Laboratorier
Publikasjoner
- Wafer bonding process for zero level vacuum packaging of MEMS Les publikasjonen
- Technological aspects of devices for efficient ion concentration polarization and electro-driven separation with ultra-shallow nanochannels
- A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding
- Through Silicon Vias in MEMS packaging, a review Les publikasjonen
- Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks Les publikasjonen
- Metal films for MEMS pressure sensors: comparison of Al, Ti, Al-Ti alloy and Al/Ti film stacks
- Vertical Interconnects for High-End MEMS Les publikasjonen
- Al-Al Wafer-Level Thermocompression Bonding applied for MEMS Les publikasjonen
- Al-Al Wafer-Level Thermocompression Bonding applied for MEMS
- Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding Les publikasjonen