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Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding

Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding

Category
Academic article
Abstract
The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity during bond anneal leads to plastic deformation of the membrane. By controlling the cavity pressure it is found that the Si crystal of the membrane can be kept intact during bond anneal.
Client
  • Research Council of Norway (RCN) / 247781
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
Year
Published in
ECS Transactions
ISSN
1938-5862
Publisher
Electrochemical Society
Volume
75
Issue
9
Page(s)
311 - 319