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A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding

A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding

Category
Poster
Language
English
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
Presented at
MNE2019
Place
Rhodes
Date
23.09.2019 - 26.09.2019
Organizer
45th International Conference on Micro and Nano Engineering
Year