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A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding

Category

Poster

Language

English

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology

Presented at

MNE2019

Place

Rhodes

Date

23.09.2019 - 26.09.2019

Organizer

45th International Conference on Micro and Nano Engineering

Year

2019

View this publication at Cristin