A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding
Category
Poster
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
MNE2019
Place
Rhodes
Date
23.09.2019 - 26.09.2019
Organizer
45th International Conference on Micro and Nano Engineering