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Vertical Interconnects for High-End MEMS

Vertical Interconnects for High-End MEMS

Category
Academic chapter/article/Conference paper
Abstract
The following sections are included:
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References

Client
  • Research Council of Norway (RCN) / 247781
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Digital / Smart Sensor Systems
Year
Publisher
World Scientific
Book
MEMS Packaging
Issue
5
ISBN
978-981-3229-35-8
Page(s)
45 - 52