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Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding

Abstract

The residual gas pressure (RGP) in sealed cavities was measured by residual gas analysis (RGA). The cavity sealed by fusion bonding had the lowest RGP of 16 µbar. Cavities sealed by Au-Au thermocompression bonding and plasma bonding had RGPs of 0.18 and 0.22 mbar, respectively. The cavity sealed by Al-Al thermocompression bonding had RGP of 1.3 mbar. Cavities sealed by thermocompression bonding contained 0.16 – 0.21 mbar Ar. The leak rates of the four seal types were estimated by three methods. RGA measurements revealed that the maximum leakage rates were between 10-13 and 10-15 mbar·l·s-1.

Category

Academic chapter/article/Conference paper

Client

  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

  • Kari Schjølberg-Henriksen
  • Nishant Malik
  • Åsmund Sandvand
  • Gjermund Kittilsland
  • Sigurd T. Moe

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • University of Oslo
  • University of South-Eastern Norway
  • Diverse norske bedrifter og organisasjoner
  • SensoNor ASA

Year

2014

Publisher

The Electrochemical Society

Book

2014 ECS and SMEQ Joint International Meeting, October 5, 2014 - October 9, 2014 Semiconductor Wafer Bonding 13: Science, Technology, and Applications

Issue

5

ISBN

978-1-62332-185-7

Page(s)

305 - 314

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