Publikasjoner
- Urodynamics with MEMS-Based pressure sensors, a clinical validation
- Low-loss, low-background aluminum oxide waveguide platform for broad-spectrum on-chip microscopy
- From wires to waves, a novel sensor system for in vivo pressure monitoring Les publikasjonen
- 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
- Thermal management of MEMS element with thermoelectric-cooler
- Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles Les publikasjonen
- Wafer bonding process for zero level vacuum packaging of MEMS Les publikasjonen
- Single digit parts-per-billion NOx detection using MoS2/hBN transistors Les publikasjonen
- Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
- Boron-doping of cubic SiC for intermediate band solar cells: a scanning transmission electron microscopy study
Annen formidling
- Optimising thermal management of MEMS element with thermoelectric-cooler
- Silicide module produced in the TESil project
- NOx detection by MoS2/hBN heterostructures
- NOx detection by MoS2/hBN heterostructures
- Through Silicon Vias in MEMS packaging, a review Les publikasjonen
- Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
- Gas sensors based on 2D heterostructures
- Reliability of Conductive Adhesives for IoT
- Hygrothermal aging of flip-chip assembled MOEMS
- Bending Machine for Testing Reliability of Flexible Electronics