To main content

Hygrothermal aging of flip-chip assembled MOEMS

Hygrothermal aging of flip-chip assembled MOEMS

Category
Lecture
Abstract
A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solution passed in situ electrical testing successfully during exposure to 85% relative humidity for 840 hours at 85 °C and 1000 hours at 95 °C. Two tested variants of the novel ICA were shown to perform better than a commercial reference material. Failures were observed for samples with the reference material after long exposure times or cool-down. Cross sections were made for inspection of failure mechanisms.
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Digital / Microsystems and Nanotechnology
  • Unknown
Presented at
13th International Conference and Exhibition on Device Packaging (DPC)
Place
Fountain Hills, AZ
Date
07.03.2017 - 09.03.2017
Organizer
IMAPS
Year