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Hygrothermal aging of flip-chip assembled MOEMS

Abstract

A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solution passed in situ electrical testing successfully during exposure to 85% relative humidity for 840 hours at 85 °C and 1000 hours at 95 °C. Two tested variants of the novel ICA were shown to perform better than a commercial reference material. Failures were observed for samples with the reference material after long exposure times or cool-down. Cross sections were made for inspection of failure mechanisms.

Category

Lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Digital / Microsystems and Nanotechnology
  • Unknown

Presented at

13th International Conference and Exhibition on Device Packaging (DPC)

Place

Fountain Hills, AZ

Date

07.03.2017 - 09.03.2017

Organizer

IMAPS

Year

2017

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