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Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Category

Academic chapter/article/Conference paper

Language

English

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Industry / Sustainable Energy Technology

Year

2019

Publisher

IEEE conference proceedings

Book

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

ISBN

978-0-9568086-6-0

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