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Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Category
Academic chapter/article/Conference paper
Language
English
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Industry / Sustainable Energy Technology
Year
Publisher
IEEE conference proceedings
Book
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
978-0-9568086-6-0