Through Silicon Vias in MEMS packaging, a review
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Category
Academic lecture
Client
- EC/H2020 / 785337
Language
English
Author(s)
- Guido Sordo
- Daniel Nilsen Wright
- Sigurd Moe
- cristian collini
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Unknown
Presented at
NordPac 2019
Place
Lyngby
Date
11.06.2019 - 13.06.2019
Organizer
IMAPS Nordic