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Through Silicon Vias in MEMS packaging, a review

Category

Academic lecture

Client

  • EC/H2020 / 785337

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • Unknown

Presented at

NordPac 2019

Place

Lyngby

Date

11.06.2019 - 13.06.2019

Organizer

IMAPS Nordic

Year

2019

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