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Through Silicon Vias in MEMS packaging, a review

Through Silicon Vias in MEMS packaging, a review

Category
Academic lecture
Client
  • EC/H2020 / 785337
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • Unknown
Presented at
NordPac 2019
Place
Lyngby
Date
11.06.2019 - 13.06.2019
Organizer
IMAPS Nordic
Year