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Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Category

Lecture

Language

English

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Industry / Sustainable Energy Technology

Presented at

European Microelectronics and Packaging Conference (EMPC2019)

Place

Pisa

Date

16.09.2019 - 19.09.2019

Organizer

IMAPS Italy

Year

2019

View this publication at Cristin