Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity
Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing membrane structures to wafers with patterned bonding frames. The laminates were...
- Forfattere
- Nishant Malik
- Erik Poppe
- Kari Schjølberg-Henriksen
- Maaike Margrete Visser Taklo
- Terje Finstad
- År
- 2015
- Type
- Vitenskapelig artikkel