...constrained by the solder alloy, as it is more susceptible to electromigration than the copper used for the pads and wires. Hence, interconnects formed by copper only mitigate the electromigration risk and/or allow to increase the current limit of the all-copper interconnect. In this work, two methods to form...
- Forfattere
- Jonas Zürcher
- Kerry Yu
- Gerd Schlottig
- Mario Baum
- Maaike Margrete Visser Taklo
- Bernhard Wunderle
- Piotr Warszynski
- Thomas Brunschwiler
- År
- 2015
- Type
- Vitenskapelig kapittel