- Forfattere
- Erik Harborg
- År
- 1997
- Type
- Foredrag
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Analysing Evolution of Work and Load
Evolution of work and load is required for investigating elasticity and cost-efficiency of cloud computing applications as well as their underlying architecture. Existing modelling environments have fixed load and work, therefore rendering model-and-analyse approaches infeasible for such applications...
- År
- 2016
- Type
- Konferanseforedrag
A drone and small satellite innovation center?
- Forfattere
- Aksel A Transeth
- Asgeir Johan Sørensen
- Tor Arne Johansen
- Rune Storvold
- Anne Marthine Rustad
- År
- 2019
- Type
- Foredrag
Quantum Computing and the Gemini Center
- Forfattere
- Franz Georg Fuchs
- År
- 2022
- Type
- Foredrag
Drug Discovery and DNA glycosylase Inhibitors
- Forfattere
- Torkild Visnes
- År
- 2022
- Type
- Konferanseforedrag
- År
- 2022
- Type
- Konferanseforedrag
- Forfattere
- Ragnar Strandbakke
- María Balaguer
- Alfonso Carrillo
- Sebastian Lech Wachowski
- Aleksandra Mielewczyk-Gryń
- Iga Szpunar
- Tadeusz Miruszewski
- Magnus Helgerud Sørby
- Einar Vøllestad
- Vegar Øygarden
- Sarmad Waheed Saeed
- Maria Gazda
- José M. Serra
- Truls Norby
- År
- 2021
- Type
- Konferanseforedrag
...transport and shipping sector, the Single Window (SW) concept has been evolved over time in a number of forms, reflecting respective policy, regulatory, market and technological regimes of the domain. A SW primarily addresses the need for efficient electronic transactions between governmental and business...
- År
- 2011
- Type
- Vitenskapelig artikkel
Ways to Circular and Transparent Value Chains
...knowledge about the implementation of circularity and other sustainability approaches in value chains. The objective is to develop roadmaps for the implementation of digital Circular manufacturing (CMA) and Social-life cycle (S-LCA) assessments in Textile and Clothing (TC) value chains. Implementing these...
- År
- 2022
- Type
- Vitenskapelig kapittel
- Forfattere
- Randi Eidsmo Reinertsen
- År
- 1996
- Type
- Vitenskapelig kapittel
SAFESUB: Safe and Autonomous Subsea Intervention
...robotic solutions capable of operating in complex and dangerous environments – such as those found in inspection and maintenance (I&M) operations – is growing. However, the success of autonomous system deployments relies heavily on their actual and humanperceived safety. Current AI-based predictions...
- Forfattere
- Aksel A Transeth
- Jostein Thorstensen
- Ahmed Kedir Mohammed
- Jens T Thielemann
- Klaus Ening
- Esten Ingar Grøtli
- Bent Oddvar Arnesen Haugaløkken
- Martin Albertsen Brandt
- Ments Tore Møller
- Rebecca Petterteig Hovland
- Odd Steinar Erland
- Ingrid Bouwer Utne
- Ingrid Schjølberg
- År
- 2024
- Type
- Konferanseforedrag
- År
- 2022
- Type
- Konferanseabstrakt
Cloud storage cost: a taxonomy and survey
...virtually infinite storage and computing resources, while providing cost-efficiency and various other quality of service (QoS) properties through a storage-as-a-service (StaaS) approach. Organizations also use multicloud or hybrid solutions by combining multiple public and/or private cloud service providers...
- År
- 2024
- Type
- Vitenskapelig artikkel
- Forfattere
- Ole Jacob Broch
- År
- 2024
- Type
- Foredrag
The CEN workshop aims to establish a common language (definitions and vocabulary) for materials characterisation and modelling. It aims to update a previous CEN Workshop Agreement on the same topic. Our work on the Characterisation Methodology Ontology (CHAMEO) will underpin the updates to provide a...
- År
- 2025
- Type
- Policyrapport
Crossed ladders and Euler's quartic
- Forfattere
- Andrew Bremner
- Ralph Høibakk
- Dag Lukkassen
- År
- 2009
- Type
- Vitenskapelig artikkel
ZeSiM - Project Overview and Highlights
- Forfattere
- Gøril Jahrsengene
- År
- 2025
- Type
- Foredrag
Prosjektleder: Hans Yngvar Torvatn Thale Kvernberg Andersen Mariann ... Prosjektleder: Hans Yngvar Torvatn Thale Kvernberg Andersen Mariann Sandsund Ansattinfo mangler Stian Antonsen ...
- År
- 2016
- Type
- Forskningsrapport
...gate dimensions alone will not be able to overcome the performance and cost problems of future IC fabrication. Today 3D integration based on through silicon vias (TSV) is a well-accepted approach to overcome the performance bottleneck and simultaneously shrink the form factor. Several full 3D process flows...
- Forfattere
- Peter Ramm
- Armin Klumpp
- Josef Weber
- Nicolas Lietaer
- Maaike M. Visser Taklo
- W. de Raedt
- Thomas Fritzsch
- Pascal Couderc
- År
- 2010
- Type
- Vitenskapelig artikkel