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This paper presents the fabrication and characterization of a 1–3 silicon-polymer composite matching layer made by Deep Reactive Ion Etch (DRIE) method. A well-defined composite layer thickness of 83 µm was obtained by using Silicon-on-Insulator (SOI) wafers as substrate. The resulting composite has...

Anisotropic conductive film (ACF) has been used for flip chip interconnection of a silicon based MEMS finger print sensor to a signal processing ASIC. The assembled sensor device was subjected to a short term high temperature profile with peak temperature 260°C simulating subsequent reflow...

In the recent years, wearable devices have attracted substantial attention from researchers and industrial manufacturers. The use of smart textiles can give a high evolution of the interaction of human individuals with electronic devices. However, the technology faces challenges regarding...

Rapport fra Samrisk prosjektet case på vannforsyningen....