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We refine two low-order structure factors of the skutterudite CoSb3 using convergent beam electron diffraction. The relatively large unit cell of this material causes the disks to overlap and introduces a series of challenges in the refinement procedure. These challenges and future work-arounds are...

Multi-wire sawing of silicon wafers is a tribological process. Slurry consisting of small silicon carbide particles embedded in polyethyleneglycol carries out the abrasive material removal process. During this process small silicon chips are removed from the bulk material. Low coherence...