Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS)
In this study, we explore the thermo-mechanical stress distribution of a chip/substrate BGA interconnect based on metal coated polymer spheres (MPS) of 30 μm diameter. The bonding of the chip to a glass substrate with MPS is obtained by deposition and sintering of a silver nanoparticle suspension...
- Forfattere
- Faycal Riad Hamou
- Daniel Nilsen Wright
- Astrid-Sofie Vardøy
- Marie Haupt
- Susanne Helland
- Helge Kristiansen
- Maaike Margrete Visser Taklo
- År
- 2015
- Type
- Foredrag