Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
Kategori
Vitenskapelig kapittel
Språk
Engelsk
Forfatter(e)
- Daniel Nilsen Wright
- Branson Belle
- Joachim Seland Graff
Institusjon(er)
- SINTEF Industri / Bærekraftig energiteknologi
- SINTEF Digital / Smart Sensors and Microsystems
År
2019Forlag
IEEE (Institute of Electrical and Electronics Engineers)
Bok
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
9780956808660