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Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres

Kategori
Faglig foredrag
Språk
Engelsk
Institusjon(er)
  • SINTEF Digital / Microsystems and Nanotechnology
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Industri / Bærekraftig energiteknologi
Presentert på
European Microelectronics and Packaging Conference (EMPC2019)
Sted
Pisa
Dato
16.09.2019 - 19.09.2019
Arrangør
IMAPS Italy
År