Sammendrag
The following sections are included:
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References
Vitenskapelig Kapittel/Artikkel/Konferanseartikkel
Engelsk
World Scientific
MEMS Packaging
5
978-981-3229-35-8
45 - 52