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Use of Conductive Adhesive for MEMS Interconnection in Military Fuze Applications

Sammendrag

A novel conductive adhesive has been used to interconnect MEMS test structures with different pad sizes directly to a PCB in a medium caliber ammunition fuze. The fuze environment is very demanding with a setback acceleration exceeding 60 000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures have been subjected to rapid temperature cycling according to MIL-STD 883G method 1010.8 test condition B and performed well. The test structures with the largest pad sizes passed 100 temperature cycles and firing test where the test structures have been exposed to an acceleration of more than 60 000 g.

Kategori

Vitenskapelig foredrag

Språk

Engelsk

Forfatter(e)

  • Jakob Gakkestad
  • Per G. Dalsjø
  • Helge Kristiansen
  • Rolf Johannessen
  • Maaike Margrete Visser Taklo

Institusjon(er)

  • Forsvarets forskningsinstitutt
  • Ukjent
  • SINTEF Digital
  • SINTEF Digital / Smart Sensor Systems

Presentert på

Conference on Reliability, Packaging, Testing and Characterization of MEMS/MOEMS and Nanodevices IX

Sted

San Francisco, CA

Dato

25.01.2010 - 26.01.2010

Arrangør

SPIE

År

2010

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