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Cracks, inclusions and microscopy of Si at SINTEF ICT

Sammendrag

The activity on optical inspection of silicon wafers at SINTEF ICT has a focus on micro crack detection and NIR microscopy. The Scanning Near Infra-Red Microscopy (SNIRM) configuration and experimental setup, as well as measurement results on microcracks and inclusions were presented. Short introduction to immersion optics with silicon lenses.

Kategori

Vitenskapelig foredrag

Språk

Engelsk

Forfatter(e)

Institusjon(er)

  • SINTEF Digital / Smart Sensor Systems

Presentert på

Nordic workshop for mechanical issues for silicon wafers and cells

Sted

Rosenholm

Dato

25.11.2010 - 25.11.2010

Arrangør

Zwick Norge & SINTEF MK

År

2010

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