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High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization

High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization

Kategori
Vitenskapelig artikkel
Språk
Engelsk
Forfatter(e)
Institusjon(er)
  • SINTEF Digital / Smart Sensor Systems
År
Publisert i
Microelectronics and reliability
ISSN
0026-2714
Årgang
48
Hefte nr.
10
Side(r)
1711 - 1719