Til hovedinnhold

Au-Sn SLID bonding: A reliable HT interconnect and die attach technology

Au-Sn SLID bonding: A reliable HT interconnect and die attach technology

Kategori
Vitenskapelig artikkel
Sammendrag
Au-Sn solid–liquid interdiffusion (SLID) bonding is an established reliable high temperature (HT) die attach and interconnect technology. This article presents the life cycle of an optimized HT Au-Sn SLID bond, from fabrication, via thermal treatment, to mechanical rupture. The layered structure of a strong and uniform virgin bond was identified by X-ray diffraction to be Au/ζ (Au0.85Sn0.15)/Au. During HT exposure, it was transformed to Au/β (Au1.8Sn0.2)/Au. After HT exposure, the die shear strength was reduced by 50 pct, from 14 Pa to 70 MPa, which is still remarkably high. Fractographic studies revealed a change in fracture mode; it was changed from a combination of adhesive Au/Ni and cohesive SiC fracture to a cohesive β-phase fracture. Design rules for high quality Au-Sn SLID bonds are given.
Oppdragsgiver
  • Research Council of Norway (RCN) / 193108
  • Research Council of Norway (RCN) / 193108/S60
Språk
Engelsk
Forfatter(e)
  • Torleif Andre Tollefsen
  • Andreas Larsson
  • Maaike Margrete Visser Taklo
  • Antonia Neels
  • Xavier Maeder
  • Kristin Høydalsvik
  • Dag Werner Breiby
  • Knut E. Aasmundtveit
Institusjon(er)
  • Universitetet i Sørøst-Norge
  • SINTEF Digital / Smart Sensor Systems
  • Centre Suisse d'Electronique et de Microtechnique SA
  • Norges teknisk-naturvitenskapelige universitet
År
Publisert i
Metallurgical and Materials Transactions B
ISSN
1073-5615
Forlag
Springer
Årgang
44
Hefte nr.
2
Side(r)
406 - 413