Publikasjoner
- High strength die-attach for structural monitoring sensors
- Frykter store konsekvenser av økt avgift
- Soldering of components onto a smart tag - an evaluation of the process window
- Bending machine for testing reliability of flexible electronics Les publikasjonen
- Smart Tags that are exactly Reliable Enough Les publikasjonen
- Hygrothermal aging of flip-chip assembled MOEMS
- Bending Machine for Testing Reliability of Flexible Electronics
- Soldering of components onto a smart tag - an evaluation of the process window
- Smart Tags that are exactly Reliable Enough
- All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering