- Enhet:
- SINTEF Digital
- Avdeling:
- Smarte sensorer og mikrosystemer
- Kontorsted:
- Oslo
Publikasjoner
- Soldering of components onto a smart tag - an evaluation of the process window
- Bending machine for testing reliability of flexible electronics
- Smart Tags that are exactly Reliable Enough
- Hygrothermal aging of flip-chip assembled MOEMS
- Bending Machine for Testing Reliability of Flexible Electronics
- Soldering of components onto a smart tag - an evaluation of the process window
- Smart Tags that are exactly Reliable Enough
- All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor
- All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering