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Erik Poppe

Research Manager

Erik Poppe

Research Manager

Erik Poppe
Phone: 930 59 342
Department: Microsystems and Nanotechnology
Office: Oslo

Publications and responsibilities

Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1657936

Thermo-mechanical stability of metal structures is one of the key factors affecting accuracy of micro-electromechanical (MEMS) piezoresistive pressure sensors. In this work, we present the measurement results of stress and hysteresis for the following metals deposited in the same sputtering equipmen...

Authors Vereshchagina Elizaveta Poppe Erik Utne Schjølberg-Henriksen Kari Wöhrmann Markus Moe Sigurd T.
Year 2018
Type Part of a book/report
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1479512

Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are common...

Authors Taklo Maaike M. Visser Schjølberg-Henriksen Kari Malik Nishant Poppe Erik Utne Moe Sigurd T. Finstad Terje
Year 2017
Type Part of a book/report
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1462979

Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. T...

Authors Malik Nishant Venkatachalapathy Vishnukanthan Dall Wilhelm Schjølberg-Henriksen Kari Poppe Erik Utne Taklo Maaike M. Visser Finstad Terje
Year 2017
Type Journal publication
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1406279

The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity during bond anneal leads to plastic deformation of the membrane. By controlling t...

Authors Poppe Erik Utne Jensen Geir Uri Moe Sigurd T. Wang Dag Thorstein
Year 2016
Type Journal publication
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1358278

Interfaces formed by Al-Al thermocompression bonding were studied by the transmission electron microscopy. Si wafer pairs having patterned bonding frames were bonded using Al films deposited on Si or SiO2 as intermediate bonding media. A bond force of 36 or 60 kN at bonding temperatures ranging from...

Authors Malik Nishant Carvalho Patricia Poppe Erik Finstad Terje
Year 2016
Type Journal publication
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1240517

Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing membrane structures to wafers with patterned bonding frames. The laminates were bon...

Authors Malik Nishant Poppe Erik Schjølberg-Henriksen Kari Taklo Maaike Margrete Visser Finstad Terje
Year 2015
Type Journal publication