Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Nishant Malik
- Erik Poppe
- Kari Schjølberg-Henriksen
- Maaike Margrete Visser Taklo
- Terje Finstad
Affiliation
- University of Oslo
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
The 226th Meeting of the Electrochemical Society
Place
Cancun
Date
05.10.2014 - 09.10.2014
Organizer
The Electrochemical Society