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Al-Al Wafer-Level Thermocompression Bonding applied for MEMS

Al-Al Wafer-Level Thermocompression Bonding applied for MEMS

Category
Academic lecture
Client
  • Research Council of Norway (RCN) / 210601
  • Research Council of Norway (RCN) / 247781
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Smart Sensor Systems
  • University of Oslo
  • SINTEF Digital / Microsystems and Nanotechnology
Presented at
5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
Place
Tokyo
Date
16.05.2017 - 18.05.2017
Organizer
The Univeristy of Tokyo (IEEE CPMT Society, JSPS)
Year