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Al-Al Wafer-Level Thermocompression Bonding applied for MEMS

Category

Academic lecture

Client

  • Research Council of Norway (RCN) / 247781
  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensor Systems
  • University of Oslo
  • SINTEF Digital / Microsystems and Nanotechnology

Presented at

5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)

Place

Tokyo

Date

16.05.2017 - 18.05.2017

Organizer

The Univeristy of Tokyo (IEEE CPMT Society, JSPS)

Year

2017

View this publication at Cristin