Low-temperature bonding technologies for MEMS and 3D-IC
Category
Lecture
Client
- Research Council of Norway (RCN) / 229945
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Maaike Margrete Visser Taklo
- Kari Schjølberg-Henriksen
- Nishant Malik
- Hannah Rosquist Tofteberg
- Erik Poppe
- David Oscar Vella
- Joshua Borg
- Zlatko Hajdarevic
- Armin Klumpp
- Peter Ramm
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of Oslo
- Unknown
Presented at
2014 4th IEEE International Workshop on Low Tempareture Bonding for 3D Integration
Place
Tokyo
Date
15.07.2014 - 16.07.2014
Organizer
University of Tokyo