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Erik Poppe

Research Manager

Erik Poppe

Research Manager

Erik Poppe
Phone: 930 59 342
Email:
Department: Microsystems and Nanotechnology
Office: Oslo

Publications and responsibilities

Publication
https://www.sintef.no/en/publications/publication/1479512/

Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are...

Authors Maaike M. Visser Taklo Kari Schjølberg-Henriksen Nishant Malik Erik Poppe Sigurd T. Moe Terje Finstad
Year 2017
Type Academic chapter/article/Conference paper
Publication
https://www.sintef.no/en/publications/publication/1462979/

Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively...

Authors Nishant Malik Vishnukanthan Venkatachalapathy Wilhelm Dall Kari Schjølberg-Henriksen Erik Poppe Maaike M. Visser Taklo Terje Finstad
Year 2017
Type Academic article
Publication
https://www.sintef.no/en/publications/publication/1358278/

Interfaces formed by Al-Al thermocompression bonding were studied by the transmission electron microscopy. Si wafer pairs having patterned bonding frames were bonded using Al films deposited on Si or SiO2 as intermediate bonding media. A bond force of 36 or 60 kN at bonding temperatures ranging from...

Authors Nishant Malik Patricia Almeida Carvalho Erik Poppe Terje Finstad
Year 2016
Type Academic article
Publication
https://www.sintef.no/en/publications/publication/1406279/

The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity during bond anneal leads to plastic deformation of the membrane. By controlling...

Authors Erik Poppe Geir Uri Jensen Sigurd T. Moe Dag Thorstein Wang
Year 2016
Type Academic article
Publication
https://www.sintef.no/en/publications/publication/1240517/

Hermeticity, reliability and strength of Al-Al thermocompression bonds realized by applying different bonding parameters have been investigated. Laminates of diameter 150 mm were realized by bonding wafers containing membrane structures to wafers with patterned bonding frames. The laminates were...

Authors Nishant Malik Erik Poppe Kari Schjølberg-Henriksen Maaike Margrete Visser Taklo Terje Finstad
Year 2015
Type Academic article
Publication
https://www.sintef.no/en/publications/publication/1239966/

Hermeticity, reliability and strength of four laminates bonded at different temperatures by Au-Au thermocompression bonding have been investigated. Laminates with a diameter of 150 mm were realized by bonding a wafer containing membrane structures to a Si wafer with patterned bond frames. A bond...

Authors Nishant Malik Hannah Rosquist Tofteberg Erik Poppe Terje Finstad Kari Schjølberg-Henriksen
Year 2015
Type Academic article