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Sigurd T. Moe

Senior Research Scientist

Sigurd T. Moe

Senior Research Scientist

Sigurd T. Moe
Phone: 975 80 163
Email:
Department: Microsystems and Nanotechnology
Office: Oslo

Publications and responsibilities

Publication
https://www.sintef.no/en/publications/publication/1479512/

Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are...

Authors Maaike M. Visser Taklo Kari Schjølberg-Henriksen Nishant Malik Erik Poppe Sigurd T. Moe Terje Finstad
Year 2017
Type Academic chapter/article/Conference paper
Publication
https://www.sintef.no/en/publications/publication/1406279/

The effect of bond anneal in Si-Si direct bonding of laminates With thin membranes suspending closed cavities is studied. For membranes of a certain size and thickness, it is found that the under-pressure in the cavity during bond anneal leads to plastic deformation of the membrane. By controlling...

Authors Erik Poppe Geir Uri Jensen Sigurd T. Moe Dag Thorstein Wang
Year 2016
Type Academic article