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Nicolas Lietaer

Senior Research Scientist

Nicolas Lietaer

Senior Research Scientist

Nicolas Lietaer
Phone: 932 61 786
Email:
Department: Microsystems and Nanotechnology
Office: Oslo

Publications and responsibilities

Publication
https://www.sintef.no/en/publications/publication/1879324/

In order to support the high luminosity upgrades at ATLAS and CMS, thinned silicon sensors for hybrid pixel detectors are critical to improve radiation hardness, reduce detector mass, and address high occupancy rates. Because silicon wafer processing tools are not equipped to handle thin wafers, the...

Authors Julie Segal Nicolas Lietaer Marco Povoli
Year 2019
Type Poster
Publication
https://www.sintef.no/en/publications/publication/1678253/

SINTEF in collaboration with University of Oslo have been performing R&D activities on 3D detectors with the aim to qualify to be a production site for ITk upgrade. In this context, a 3D detector fabrication run has been completed recently with very promising results. Various sensor geometries...

Authors Ozhan Koybasi Marco Povoli Angela Chun Ying Kok Anand Summanwar Lars Breivik Trond Andreas Hansen Nicolas Lietaer Ole Myren Røhne Heidi Sandaker
Year 2018
Type Academic lecture
Publication
https://www.sintef.no/en/publications/publication/1458745/

Metalized micron scale polymer particles have been utilised in anisotropically conductive adhesives for a number of years and more recent work has investigated their selective deposition to provide interconnects. In this work such particles have successfully been deposited onto substrates that...

Authors Mark W, Sugden Junlei Tao Changqing Liu David A. Hutt David C. Whalley Nicolas Lietaer
Year 2016
Type Academic chapter/article/Conference paper
Publication
https://www.sintef.no/en/publications/publication/1392949/

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly...

Authors Simon J. Bleiker Maaike Margrete Visser Taklo Nicolas Lietaer Andreas Vogl Thor Bakke Frank Niklaus
Year 2016
Type Academic article
Publication
https://www.sintef.no/en/publications/publication/917490/

...3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE...

Authors Angela Chun Ying Kok M. Boscardin G-F. Dalla Betta Cinzia Da Via G. Darbo C. Fleta Thor-Erik Hansen Jasmine Hasi Christopher Kenney Nicolas Lietaer M. Lozano Sherwood Parker G. Pellegrini Anand Summanwar
Year 2012
Type Academic chapter/article/Conference paper