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Results from the first prototype of large 3D active edge sensors

Abstract

3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.

Category

Academic chapter/article/Conference paper

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology
  • Fondazione Bruno Kessler
  • University of Trento
  • University of Manchester
  • National Institute of Nuclear Physics
  • Centro Nacional de Microelectrónica
  • SLAC National Accelerator Laboratory
  • University of Hawaii at Hilo

Year

2012

Publisher

IEEE conference proceedings

Book

2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC): Valencia, 23-29 Oct, 2011

Issue

2011

ISBN

978-1-4673-0118-3

Page(s)

1319 - 1323

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