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Results from the first prototype of large 3D active edge sensors

Results from the first prototype of large 3D active edge sensors

Category
Academic chapter/article/Conference paper
Abstract
3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • Fondazione Bruno Kessler
  • University of Trento
  • University of Manchester
  • National Institute of Nuclear Physics
  • Centro Nacional de Microelectrónica
  • SLAC National Accelerator Laboratory
  • University of Hawaii at Hilo
Year
Publisher
IEEE conference proceedings
Book
2011 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC): Valencia, 23-29 Oct, 2011
Issue
2011
ISBN
978-1-4673-0118-3
Page(s)
1319 - 1323