Publications
- Thinned Commercial Foundry-built High Energy Physics Sensors using Microwave Anneal
- Status of 3D detector development at SINTEF for ITk Upgrade
- Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections
- Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
- Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs
- Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs
- Reliability of TSV and wafer-level bonding for a 3D integrable SOI based MEMS application
- Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications
- Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications
- Results from the first prototype of large 3D active edge sensors