To main content

Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications

Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications

Category
Abstract
Language
English
Author(s)
  • Lars Geir Whist Tvedt
  • Nicolas Lietaer
  • Thor Bakke
  • Keith Redford
  • Helge Kristiansen
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • Conpart AS
Year
Published in
IMAPS 8th International Conference and Exhibition on Device Packaging, Proceedings