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Reliability of TSV and wafer-level bonding for a 3D integrable SOI based MEMS application

Reliability of TSV and wafer-level bonding for a 3D integrable SOI based MEMS application

Category
Academic lecture
Language
English
Author(s)
  • Torleif Andre Tollefsen
  • Maaike Margrete Visser Taklo
  • Thor Bakke
  • Nicolas Lietaer
  • Per G. Dalsjø
  • Jakob Gakkestad
Affiliation
  • University of South-Eastern Norway
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Digital / Microsystems and Nanotechnology
  • Norwegian Defence Research Establishment
Presented at
International Wafer-Level Packaging Conference
Place
San Jose
Date
05.11.2012 - 08.11.2012
Organizer
SMTA and Chip Scale Review
Year