Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications
Category
Academic lecture
Language
English
Author(s)
- Lars Geir Whist Tvedt
- Nicolas Lietaer
- Thor Bakke
- Keith Redford
- Helge Kristiansen
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Conpart AS
Presented at
IMAPS 8th International Conference and Exhibition on Device Packaging
Place
Scottsdale, Arizona
Date
05.03.2012 - 08.03.2012
Organizer
IMAPS