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Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications

Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications

Category
Academic lecture
Language
English
Author(s)
  • Lars Geir Whist Tvedt
  • Nicolas Lietaer
  • Thor Bakke
  • Keith Redford
  • Helge Kristiansen
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
  • Conpart AS
Presented at
IMAPS 8th International Conference and Exhibition on Device Packaging
Place
Scottsdale, Arizona
Date
05.03.2012 - 08.03.2012
Organizer
IMAPS
Year