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Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

Category
Academic chapter/article/Conference paper
Client
  • Research Council of Norway (RCN) / 210601
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Microsystems and Nanotechnology
Year
Publisher
EDA Publishing Association
Book
Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014
ISBN
9782355000287
Page(s)
351 - 355