Al–Al thermocompression bonding suitable for wafer level sealing of MEMS devices has been investigated. This paper presents a comparison of thermocompression bonding of Al films deposited on Si with and without a thermal oxide (SiO2 film). Laminates of diameter 150 mm containing device sealing...
Silicon direct wafer bonding is a process with many application areas. Depending on the application, perfect insulation or negligible resistance is desired across the bonded interface. We have investigated the resistivity of hydrophilic high-temperature silicon direct wafer bonds by measuring the...
This paper reports on an experiment investigating how the number of simultaneous users affects the usability and user experience of a shareable user interface. Participants were instructed to complete individual drawing tasks on a shareable user interface running on a multi-touch surface table. The...
Competence brokering and knowledge transfer plays an important role in innovation and development of regions within a country. The Research Council of Norway administrates an innovation programme named VRI (Program for Regional R&D and Innovation) to facilitate this kind of development. VRI has...
In this paper, a distributed linear MPC approach to solve the trajectory planning problem for rotary-wing UAVs is proposed, where the objective of the UAV system is to form a communication network to multiple targets with given radio communication capacities. The approach explicitly incorporates...
This paper presents partial phase relations for the systems NaF–CaF2, NaF–CaF2–CaO, NaF–CaF2–CaCO3, NaF–CaF2–NaCO3, and NaF–CaF2–Na2CO3–CaCO3. The data were obtained by thermal analysis (TA), thermodynamic calculations (FactSage), and X-ray diffraction (XRD) of quenched samples. There was particular...
The electrical, mechanical, and hermeticity properties of low-temperature, plasma activated direct silicon bonds were investigated. On individual dies with a bonding area ranging from 1 – 4 mm2, the bonded interface was found to have a capacitance ranging from 2.62 pF/mm2 – 2.89 pF/mm2 at 1 kHz...
Al/Ti metallic composites prepared by insert moulding are attracting more attention now because of their low production costs, low energy consumption, simple production procedure and high interface bonding strength. However, the insert moulding of pure Al and pure Ti has not been reported so far...