Expertise
Publications
- Re-examination of PressPack test objects after seven years of storage
- Experimental validation of linear damage superposition for IBGT power modules under high and low temperature stress cycles
- Improving monitoring of parallel ageing of IGBT bond-wires and solder layers by temperature compensation
- Failure analysis and lifetime assessment of IGBT power modules at low temperature stress cycles Read publication
- Limitations and Guidelines for Damage Estimation Based on Lifetime Models for High-Power IGBTs in Realistic Application Conditions Read publication
- Challenges and Strategies for a Real-Time Implementation of a Rainflow-Counting Algorithm for Fatigue Assessment of Power Modules Read publication
- Challenges of SiC MOSFET Power Cycling Methodology Read publication
- Driver stage implementation with improved turn-on and turn-off delay for wide band gap devices Read publication
- Liquid insulation of IGBT modules: Long term chemical compatibility and high voltage endurance testing
- Analysis of power cycling for semiconductor devices in modular multilevel converters