Publications
- Soldering of components onto a smart tag - an evaluation of the process window
- Bending machine for testing reliability of flexible electronics Read publication
- Smart Tags that are exactly Reliable Enough Read publication
- All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Analyzing thermo-mechanical reliability of an interconnect based on metal coated polymer spheres (MPS)
- High-temperature mechanical integrity of Cu-Sn SLID wafer-level bonds
- Characterization of wafer-level au-in-bonded samples at elevated temperatures
- Thermomechanical Reliability of Gold Stud Bump Bonding for Large Volume MEMS Devices
- High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In
- Development of a wearable multisensor device enabling continuous monitoring of vital signs and activity
Other
- High strength die-attach for structural monitoring sensors
- Frykter store konsekvenser av økt avgift
- Hygrothermal aging of flip-chip assembled MOEMS
- Bending Machine for Testing Reliability of Flexible Electronics
- Soldering of components onto a smart tag - an evaluation of the process window
- Smart Tags that are exactly Reliable Enough
- Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor
- All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering
- All-Cu interconnects by sintered nano copper paste
- All-Copper Interconnects for Homogeneous and Heterogeneous Assemblies