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Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor

Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor

Category
Academic lecture
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Smart Sensor Systems
  • Unknown
  • SINTEF Industry / Sustainable Energy Technology
  • University of Oslo
Presented at
12th International Conference and Exhibition on Device Packaging
Place
Scottsdale
Date
15.03.2016 - 17.03.2016
Organizer
IMAPS
Year