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Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor

Category

Academic lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensor Systems
  • Unknown
  • SINTEF Industry / Sustainable Energy Technology
  • University of Oslo

Presented at

12th International Conference and Exhibition on Device Packaging

Place

Scottsdale

Date

15.03.2016 - 17.03.2016

Organizer

IMAPS

Year

2016

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