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All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering

All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering

Category
Academic lecture
Language
English
Author(s)
Affiliation
  • Unknown
  • SINTEF Digital / Smart Sensor Systems
Presented at
The 66th Electronic Components and Technology Conference - ECTC
Place
Las Vegas, NV
Date
31.05.2016 - 03.06.2016
Organizer
IEEE
Year