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All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering

Category

Academic lecture

Language

English

Author(s)

Affiliation

  • Unknown
  • SINTEF Digital / Smart Sensor Systems

Presented at

The 66th Electronic Components and Technology Conference - ECTC

Place

Las Vegas, NV

Date

31.05.2016 - 03.06.2016

Organizer

IEEE

Year

2016

View this publication at Cristin