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Bending machine for testing reliability of flexible electronics

Abstract

A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowing reliability prediction models to be developed. Four sets of test samples with different combinations of substrate, routing, interconnect technology and components were examined. A poor level of reliability was observed when using anisotropic conductive paste to form interconnects, whereas a significantly higher level of reliability was observed when using a bismuth-tin solder paste. The assembly of larger components resulted in shortened time to failure, whereas increasing the bending radius prolonged the observed lifetimes.

Category

Academic chapter/article/Conference paper

Client

  • Research Council of Norway (RCN) / 245498

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensor Systems
  • Sweden

Year

2017

Publisher

IEEE

Book

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2017), NORDPAC 2017, Gothenburg, Sweden, 18-20 June 2017

ISBN

9781538630563

View this publication at Cristin