This paper focuses on deep reactive ion etching (DRIE) of sub-micrometer features. Very high aspect ratios up to 160:1 on trenches of 250 nm have been achieved using the Bosch process and up to 120:1 on trenches of 35 nm using a cryogenic process. The proposed etch recipes are specifically optimized...
- Authors
- Jayalakshmi Parasuramana
- Anand Summanwar
- Frédéric Marty
- Philippe Basset
- Dan E. Angelescu
- Tarik Bourouina
- Year
- 2014
- Type
- Academic article