Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds
The application of plastic core solder balls (PCSB) for the assembly of a silicon (Si) interposer die inside a ceramic package has been evaluated for a harsh application. Three different variants of assembly were compared. All variants survived the performed thermal shock cycling and centrifugation...
- Authors
- Maaike Margrete Visser Taklo
- Daniel Nilsen Wright
- Joachim Seland Graff
- Patricia Almeida Carvalho
- Hanne Opsahl Austad
- Per G. Dalsjø
- Jakob Gakkestad
- Hiroya Ishida
- Christian Johnsen
- Year
- 2016
- Type
- Academic chapter