Grain structure of Aluminium films for wafer-level thermocompression bonding
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 247781
Language
English
Author(s)
- Nishant Malik
- Vishnukanthan Venkatachalapathy
- Erik Poppe
- Kari Schjølberg-Henriksen
- Maaike Margrete Visser Taklo
- Terje Finstad
Affiliation
- University of Oslo
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
WaferBond
Date
07.12.2015 - 09.12.2015