Yield and strength of metal wafer-level MEMS device sealing using Al, Au, or Ti
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Kari Schjølberg-Henriksen
- Alexander Stene Moen
- Eivind Johan Fasting
- Erik Poppe
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- OsloMet - Oslo Metropolitan University
Presented at
SMTA International Wafer Level Packaging Conference
Place
San Jose, California
Date
07.11.2012 - 08.11.2012
Organizer
Surface Mount Technology Association