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Daniel Nilsen Wright

Research Scientist

Daniel Nilsen Wright

Research Scientist

Daniel Nilsen Wright
Phone: +47 934 41 038
Department: Microsystems and Nanotechnology
Office: Oslo

Publications and responsibilities

Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1596568

In this work, a complementary microstructural and optical approach is used to define processing conditions favorable for the formation of deep boron-related acceptor centers that may provide a pathway for achieving an intermediate band behavior in highly B-doped 3C-SiC. The crystallinity, boron solu...

Authors Galeckas Augustinas Almeida Carvalho Patricia Ma Quanbao Azarov Alexander Hovden Sigurd Slettemark Thøgersen Annett Wright Daniel Nilsen Diplas Spyridon Løvvik Ole Martin Jokubavicius Valdas Sun Jianwu Syväjärvi Mikael Svensson Bengt Gunnar
Year 2018
Type Journal publication
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1589929

An experiment was designed using optimal design of experiments to identify the most relevant parameters in an assembly step for a smart tag; the soldering of 0402 resistors to a polyimide backplane. The parameter window was set to reflect natural variations in production, and parameter variations we...

Authors Vardøy Astrid-Sofie Borge Garcia Alexandre Wright Daniel Nilsen Belle Branson Taklo Maaike M. Visser Hagel Olle Xie Li Danestig Magnus Eriksson Torbjörn
Year 2017
Type Part of a book/report
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1563564

A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowi...

Authors Wright Daniel Nilsen Vardøy Astrid-Sofie Borge Belle Branson Taklo Maaike Margrete Visser Hagel Olle Xie Li Danestig Magnus Eriksson Torbjörn
Year 2017
Type Part of a book/report
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1533877

A very compact and rugged 2.5-D integrated data logger has been built and tested. The data logger is capable of measuring accelerations exceeding 70 000 g. Microcontroller and flash memory as bare dies have been mounted onto a silicon interposer with through silicon vias using anisotropic conductive...

Authors Gakkestad Jakob Sollund Tomas Dalsjø Per G. Tveit Bjørn Taklo Maaike Margrete Visser Wright Daniel Nilsen Helland Susanne Kristiansen Helge Johnsen Christian
Year 2017
Type Journal publication
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1503792

Sublimation-grown 3C-SiC crystals were implanted with B ions at elevated temperature (400 °C) using multiple energies (100 to 575 keV) with a total dose of 1.3×1017 atoms/cm2 in order to form intermediate band (IB) in 3C-SiC. The samples were then annealed at 1400 °C for 60 min. An an...

Authors Ma Quanbao Carvalho Patricia Galeckas Augustinas Azarov Alexander Hovden Sigurd Slettemark Thøgersen Annett Wright Daniel Nilsen Diplas Spyridon Løvvik Ole Martin Jokubavicius Valdas Sun Jianwu Syväjärvi Mikael Svensson Bengt Gunnar
Year 2017
Type Journal publication
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1479622

An experiment was designed using optimal design of experiments to identify the most relevant parameters in an assembly step for a smart tag; the soldering of 0402 resistors to a polyimide backplane. The parameter window was set to reflect natural variations in production, and parameter variations we...

Authors Vardøy Astrid-Sofie Borge Garcia Alexandre Wright Daniel Nilsen Belle Branson Taklo Maaike M. Visser Hagel Olle Xie Li Danestig Magnus Eriksson Torbjörn
Year 2017
Type Conference lecture and academic presentation
Publication
https://www.sintef.no/en/publications/publication/?pubid=CRIStin+1458002

A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...

Authors Taklo Maaike M. Visser Wright Daniel Nilsen Kolberg Sigbjørn Vardøy Astrid-Sofie Borge Hamou Faycal Riad Vogl Andreas Bakke Thor Kristiansen Helge Kalland Erik
Year 2017
Type Conference lecture and academic presentation