Die shear strength as a function of bond frame geometry – Au-Au thermocompression bonding
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Torleif Andre Tollefsen
- Andreas Larsson
- Maaike Margrete Visser Taklo
- Erik Poppe
- Kari Schjølberg-Henriksen
Affiliation
- University of South-Eastern Norway
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
4th Electronics System Integration Technologies Conference
Place
Amsterdam
Date
17.09.2012 - 20.09.2012