Au-Sn solid-liquid interdiffusion (SLID) bonding is a novel and promising interconnect technology for high-temperature applications. This article gives a review over previously published work on Au-Sn SLID bonding. An overview of the crystal phases and the thermomechanical properties of the Au-Sn phases relevant for Au-Sn SLID bonding is given. A summary of the bonding conditions used during Au-Sn SLID bonding is presented together with results from reliability tests. Additional challenges, possibilities, and recommendations for how a reliable high-temperature Au-Sn SLID bonding should be constructed are also discussed.